Variance

Eliminate bad designs before full multiphysics simulation

Identify hotspots and failure-prone regions instantly.

Variance helps semiconductor teams prune the design space early by approximating coupled behavior and concentrating full simulation on viable candidates.

Semiconductor chip layout with multiphysics thermal heatmap overlay

Multiphysics simulation is too slow to guide early design.

Coupled thermal, electromagnetic, and mechanical interactions make each simulation expensive, which limits exploration and delays feedback.

Most designs are evaluated too late.

Prune the design space early

Variance lets teams approximate coupled behavior quickly, eliminate poor candidates early, and run full simulation only on viable designs.

Spend simulation budget where it matters most.

How it works

Semiconductor design space with IC layout parameters
01

Define design space

Set parameters, constraints, and objectives.

Rapid semiconductor design exploration point cloud
02

Explore instantly

Evaluate thousands of scenarios in seconds.

Critical hotspot identification on semiconductor die
03

Identify critical regions

Find optima, sensitivities, and instability zones.

Selective multiphysics refinement at critical chip regions
04

Refine with full simulation

Run high-fidelity models only where accuracy matters.

Fewer full multiphysics runs visualization
Fewer

full multiphysics runs

illustrative
Reduced tapeout risk visualization
Reduced

tapeout risk

illustrative
Faster design iteration visualization
Faster

design iteration

illustrative

Use cases

Semiconductor chip cross-section with thermal analysis

Chip & package thermal analysis

Screen early packaging candidates rapidly.

Die floorplan with power density heatmap

Power density optimization

Identify limiting configurations before detailed analysis.

Grid of die layout variants with screening results

Layout exploration

Narrow the layout search space quickly.

Semiconductor die thermal hotspot detection

Hotspot detection

Detect high-risk thermal regions before full multiphysics runs.

Works with your existing stack

Variance augments your current workflow. Integrates with standard simulation tools, supports iterative refinement with ground truth models, and does not require replacing existing solvers.

ANSYS
OpenFOAM
COMSOL
In-house

Keep your tools. Remove the bottleneck.

See it on your system

Bring your model, geometry, or process. We'll show you the full space in minutes.